Ultrafast at usable stability
Picosecond and sub-picosecond sources with selectable pulse duration, where the specification that matters is pulse-to-pulse stability over an eight-hour run, not the headline peak power.
Ultrafast and precisely controlled sources for laboratories, semiconductor and photonics research groups, and for the companies turning that work into a product.
Picosecond and sub-picosecond sources with selectable pulse duration, where the specification that matters is pulse-to-pulse stability over an eight-hour run, not the headline peak power.
The same source architecture available as a laboratory instrument and as an OEM module, so a process qualified on the bench transfers without being re-proved.
Documented command sets over Ethernet and serial, so the source becomes part of an experiment's own control loop rather than a black box beside it.
Deeptech and research
Single-mode continuous-wave ultraviolet source at 355, 311 and 266 nm, rack-mounted and water-cooled, for microelectronics and lithography.
200 W and 300 W continuous-wave green source at 536 nm, absorbed up to ten times more strongly by copper than an infrared beam.
Compact air-cooled OEM module, 510 to 540 nm, single-mode continuous wave with optical noise below 0.3 % rms.
Single-mode module built to any wavelength from 266 to 775 nm in 0.1 nm steps, air-cooled, with linewidth under 0.1 nm.
Rack-mounted continuous-wave green source to 50 W at 532 and 536 nm, water-cooled, for microelectronics and laser pumping.
Air-cooled pulsed source to 100 W average, 100 ns pulses at 2 to 500 kHz, with burst control down to a single pulse.
Single-mode continuous-wave source to 2 kW with M² below 1.1, for precision cutting, SLM printing and welding reflective metals.
Micromachining platform for ablative separation of thin films and wafers, with ±5 µm positioning, an air-cushion rotation axis and machine vision.
Five-axis CNC hydrolaser complex: burr-free cutting with no heat-affected zone, no focus adjustment, and micro-holes in ceramics, diamond and composites.