Processing Systems · FL-Micro
Micromachining installation
Micromachining platform for ablative separation of thin films and wafers, with ±5 µm positioning, an air-cushion rotation axis and machine vision.
Built to orderDeeptechIndustrial
Download the datasheet (PDF)A micromachining platform for semiconductor work: ablative separation of thin films and layers, wafer dicing and sapphire separation. An integrated height-positioning system and real-time laser power monitoring hold the process steady across a run, and the source can be specified in ultraviolet, green or infrared depending on the material. Proprietary control software and a machine-vision system guide the trajectory.
Specification
Optical
| Sapphire separation, thickness | 700µm |
|---|---|
| Sapphire cut width achieved | 153µm |
| Sapphire cutting taper | 1° |
| Sapphire performance achieved | 2.5mm/s |
| Silicon wafer thickness | 400 to 650µm |
| Wafer diameter | Up to 200mm |
| Wafer cut width with chips | ≤ 80µm |
| Wafer productivity | Up to 40mm/s |
| Laser source options | Ultraviolet, green or infrared |
Mechanical
| Workpiece positioning accuracy | ± 5 or betterµm |
|---|---|
| Rotation axis | Air-cushion |
Control interface
| Trajectory guidance | Machine vision system |
|---|
Applications
Ablative separation of thin films and layersSemiconductor wafer dicingSapphire separationPrecision metal mask cutting
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